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Daeyoung Kong

Stanford University

367 Panama St

Stanford, CA 94305

United States

  • Stanford University

SCHOLARLY PAPERS

3

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106

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Scholarly Papers (3)

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1.

Capillary-Driven Two-Phase Cooler for High-Heat-Flux Electronics Using Copper Wire Mesh Manifold and Enhanced Copper Inverse Opal Wick Heat Sink

Number of pages: 27 Posted: 28 May 2025
Heungdong Kwon, Roman Giglio, Daeyoung Kong, Md Rubaiet Shattique, Hyoungsoon Lee, James Palko, Ercan Dede, Mehdi Asheghi and Kenneth Goodson
Stanford University, University of California, Merced - Department of Mechanical Engineering, Stanford University, University of California, Merced, Chung-Ang University, University of California, Merced - Department of Mechanical Engineering, Toyota Research Institue of North America, Stanford University and Stanford University
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Capillary-driven boiling, copper wire mesh, copper inverse opal, two-phase heat transfer

2.

Exploring Capillary limits of Copper Wire Mesh Manifold for Area Scaling of Capillary-Driven Two-Phase Coolers

Number of pages: 30 Posted: 20 Apr 2026
Heungdong Kwon, Roman Giglio, Daeyoung Kong, Md Rubaiet Shattique, Hyoungsoon Lee, James Palko, Ercan Dede, Mehdi Asheghi and Kenneth Goodson
Stanford University, University of California, Merced - Department of Mechanical Engineering, Stanford University, University of California, Merced, Chung-Ang University, University of California, Merced - Department of Mechanical Engineering, Toyota Research Institue of North America, Stanford University and Stanford University
Downloads 21 (1,500,778)

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Capillary-driven two-phase heat transfer, manifold, area-scaling, copper wire mesh, copper inverse opal

3.

Development of a Capillary-Driven Two-Phase Microcooler Using Copper Wiremesh 3d Manifold and Silicon Micropin Fins Wicks

International Journal of Mechanical Sciences 305, 110781, 2025 [10.1016/j.ijmecsci.2025.110781]
Posted: 21 Oct 2025 Last Revised: 05 Jan 2026
Daeyoung Kong, Roman Giglio, Muhammad R. Shattique, Qianying Wu, Heungdong Kwon, James W. Palko, Hyoungsoon Lee, Ercan M. Dede, Mehdi Asheghi and Kenneth E. Goodson
Stanford University, affiliation not provided to SSRN, affiliation not provided to SSRN, Stanford University, Stanford University, affiliation not provided to SSRN, Chung-Ang University, affiliation not provided to SSRN, Stanford University and Stanford University

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thermal management, electronics cooling, capillary-driven microcooler, thin-film boiling, copper wiremesh manifold