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Kenneth E. Goodson

Stanford University

367 Panama St

Stanford, CA 94305

United States

  • Stanford University

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Development of a Capillary-Driven Two-Phase Microcooler Using Copper Wiremesh 3d Manifold and Silicon Micropin Fins Wicks

International Journal of Mechanical Sciences 305, 110781, 2025 [10.1016/j.ijmecsci.2025.110781]
Posted: 21 Oct 2025 Last Revised: 05 Jan 2026
Daeyoung Kong, Roman Giglio, Muhammad R. Shattique, Qianying Wu, Heungdong Kwon, James W. Palko, Hyoungsoon Lee, Ercan M. Dede, Mehdi Asheghi and Kenneth E. Goodson
Stanford University, affiliation not provided to SSRN, affiliation not provided to SSRN, Stanford University, Stanford University, affiliation not provided to SSRN, Chung-Ang University, affiliation not provided to SSRN, Stanford University and Stanford University

Abstract:

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thermal management, electronics cooling, capillary-driven microcooler, thin-film boiling, copper wiremesh manifold