Se Hyuk Jang

Hanyang University

Seoul

Korea, Republic of (South Korea)

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Optimization of Solder Reflow Process with Ai-Assisted Defect Analysis for Solder Joint Reliability

Number of pages: 15 Posted: 24 Apr 2025

Se Hyuk Jang, Joo Hyeong Han, Ja Hyeon Kim, Yong Ho Ko and Won Bin Im

Hanyang University, Hanyang University, Hanyang University, affiliation not provided to SSRN and Hanyang University

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