Yong Ho Ko

affiliation not provided to SSRN

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SCHOLARLY PAPERS

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Scholarly Papers (2)

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1.

Cuag Alloy-Driven Low-Temperature Bonding for Advanced 3d Packaging

Number of pages: 12 Posted: 10 May 2025

Ju-Won Jun, Seng-Hyuk Lee, Yong-Kyu Lee, Yong Ho Ko, Chang Woo Byun, Hee-Soo Kim, So-Yeon Lee and Byoung-Joon Kim

Tech University of Korea, Tech University of Korea, Tech University of Korea, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Kumoh National Institute of Technology (KIT) and Tech University of Korea

Downloads 56 (1,000,027)

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2.

Optimization of Solder Reflow Process with Ai-Assisted Defect Analysis for Solder Joint Reliability

Number of pages: 15 Posted: 24 Apr 2025

Se Hyuk Jang, Joo Hyeong Han, Ja Hyeon Kim, Yong Ho Ko and Won Bin Im

Hanyang University, Hanyang University, Hanyang University, affiliation not provided to SSRN and Hanyang University

Downloads 54 (1,086,013)

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