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Hee-Soo Kim

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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75

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0

Scholarly Papers (2)

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1.

Cuag Alloy-Driven Low-Temperature Bonding for Advanced 3d Packaging

Number of pages: 12 Posted: 10 May 2025
Ju-Won Jun, Seng-Hyuk Lee, Yong-Kyu Lee, Yong Ho Ko, Chang Woo Byun, Hee-Soo Kim, So-Yeon Lee and Byoung-Joon Kim
Tech University of Korea, Tech University of Korea, Tech University of Korea, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Kumoh National Institute of Technology (KIT) and Tech University of Korea
Downloads 56 (1,000,027)

Abstract:

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Cu Ag alloy, Chip to Chip bonding, Thermo-compression bonding, Adhesion, Double cantilever beam test

2.

Magnetocaloric properties of electrolytically hydrogenated La1.2Fe11.2Cr0.3Si1.5- x B x

Number of pages: 40 Posted: 03 Mar 2026
Jihwan Kim, K. H. Kang, Hee-Soo Kim, J.-W. Kim and Chong Seung Yoon
Hanyang University, Korea Institute of Materials Science, affiliation not provided to SSRN, Korea Institute of Materials Science and Hanyang University
Downloads 19 (1,481,165)

Abstract:

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Magnetocaloric effect, La(Fe, Si)13, electrochemical hydrogenation, magnetic refrigeration