So-Yeon Lee

Kumoh National Institute of Technology (KIT)

SCHOLARLY PAPERS

5

DOWNLOADS

173

TOTAL CITATIONS

1

Scholarly Papers (5)

Actions:
Email selected abstracts
1.

Bonding Structure and Etching Characteristics in B and N Co-Doped Amorphous Carbon Films for Hardmask Applications

Number of pages: 29 Posted: 13 Feb 2024
Hongik Kim, Ung-gi Kim, Deokgi Hong, Sungtae Kim, Seungwu Han, Young-Chang Joo and So-Yeon Lee
Seoul National University, Seoul National University, Seoul National University, Seoul National University, Seoul National University, Seoul National University and Kumoh National Institute of Technology (KIT)
Downloads 65 (742,877)
Citation 1

Abstract:

Loading...

ternary system, hardmask, etch selectivity, amorphous carbon, physical vapor deposition

2.

Boron-Doped Amorphous Carbon Deposited by Dc Sputtering for a Hardmask: Microstructure and Dry Etching Properties

Number of pages: 33 Posted: 23 May 2023
Sungtae Kim, Ung-gi Kim, Jinseok Ryu, Do-kyun Kim, Miyoung Kim, Young-Chang Joo and So-Yeon Lee
Seoul National University, Seoul National University, Seoul National University, Seoul National University, Department of Materials Science and Engineering and Research Institute of Advanced Materials, Seoul National University, Seoul National University and Kumoh National Institute of Technology (KIT)
Downloads 63 (755,190)

Abstract:

Loading...

Amorphous carbon, boron, DC sputtering, Hardmask, dry etch, Selectivity

3.

Effect of Ag Agglomeration-Driven Nanovoids Formation on Fatigue Reliability of Cu-Ag Alloy Flexible Interconnects

Number of pages: 26 Posted: 29 Aug 2023
Seongi Lee, Jae-Myeong Shin, Jun Hyeok Hyun, Young-Chang Joo, Byoung-Joon Kim and So-Yeon Lee
Seoul National University, Tech University of Korea, Kumoh National Institute of Technology (KIT), Seoul National University, Tech University of Korea and Kumoh National Institute of Technology (KIT)
Downloads 30 (1,036,422)

Abstract:

Loading...

Nanovoid, Electrical resistivity/conductivity, Copper alloys, Fatigue test, Microstructure

4.

Effect of Ag Agglomeration-Driven Nanovoids Formation on Fatigue Reliability of Cu-Ag Flexible Interconnects

Number of pages: 18 Posted: 05 Dec 2023
So-Yeon Lee, Seongi Lee, Jae-Myung Shin, Jun Hyeok Hyun, In-Suk Choi, Young-Chang Joo and Byoung-Joon Kim
Kumoh National Institute of Technology (KIT), Seoul National University, Tech University of Korea, Kumoh National Institute of Technology (KIT), Seoul National University, Seoul National University and Tech University of Korea
Downloads 12 (1,251,875)

Abstract:

Loading...

Nanovoid, Electrical resistivity/conductivity, copper alloys, Fatigue test, Microstructure

5.

Cuag Alloy-Driven Low-Temperature Bonding for Advanced 3d Packaging

Number of pages: 12 Posted: 10 May 2025
Ju-Won Jun, Seng-Hyuk Lee, Yong-Kyu Lee, Yong Ho Ko, Chang Woo Byun, Hee-Soo Kim, So-Yeon Lee and Byoung-Joon Kim
Tech University of Korea, Tech University of Korea, Tech University of Korea, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Kumoh National Institute of Technology (KIT) and Tech University of Korea
Downloads 3 (1,321,077)

Abstract:

Loading...

Cu Ag alloy, Chip to Chip bonding, Thermo-compression bonding, Adhesion, Double cantilever beam test