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Seongi Lee

Seoul National University

Kwanak-gu

Seoul, 151-742

Korea, Republic of (South Korea)

  • Seoul National University

SCHOLARLY PAPERS

3

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90

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0

Scholarly Papers (3)

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1.

Effect of Ag Agglomeration-Driven Nanovoids Formation on Fatigue Reliability of Cu-Ag Alloy Flexible Interconnects

Number of pages: 26 Posted: 29 Aug 2023
Seongi Lee, Jae-Myeong Shin, Jun Hyeok Hyun, Young-Chang Joo, Byoung-Joon Kim and So-Yeon Lee
Seoul National University, Tech University of Korea, Kumoh National Institute of Technology (KIT), Seoul National University, Tech University of Korea and Kumoh National Institute of Technology (KIT)
Downloads 44 (1,133,231)

Abstract:

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Nanovoid, Electrical resistivity/conductivity, Copper alloys, Fatigue test, Microstructure

2.

Improving Bending Fatigue Lifetime and Interfacial Adhesion of Cu–Mn Flexible Interconnects Using Self-Forming Nanolayer

Number of pages: 36 Posted: 13 Aug 2025
Jae-Myeong Shin, Seongi Lee, Jong-Sung Lee, Dong Hyeon Kim, Eun-chae Jeon, Young-Chang Joo, So-Yeon Lee and Byoung-Joon Kim
Tech University of Korea, Seoul National University, Seoul National University, University of Ulsan, University of Ulsan, Seoul National University, Kumoh National Institute of Technology (KIT) and Tech University of Korea
Downloads 28 (1,359,097)

Abstract:

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Cu-Mn alloy, flexible interconnect, self-forming layer, bending fatigue, interfacial adhesion

3.

Effect of Ag Agglomeration-Driven Nanovoids Formation on Fatigue Reliability of Cu-Ag Flexible Interconnects

Number of pages: 18 Posted: 05 Dec 2023
So-Yeon Lee, Seongi Lee, Jae-Myung Shin, Jun Hyeok Hyun, In-Suk Choi, Young-Chang Joo and Byoung-Joon Kim
Kumoh National Institute of Technology (KIT), Seoul National University, Tech University of Korea, Kumoh National Institute of Technology (KIT), Seoul National University, Seoul National University and Tech University of Korea
Downloads 18 (1,481,165)

Abstract:

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Nanovoid, Electrical resistivity/conductivity, copper alloys, Fatigue test, Microstructure