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Dong Hyeon Kim

University of Ulsan

Ulsan

Korea, Republic of (South Korea)

  • University of Ulsan

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Scholarly Papers (1)

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Improving Bending Fatigue Lifetime and Interfacial Adhesion of Cu–Mn Flexible Interconnects Using Self-Forming Nanolayer

Number of pages: 36 Posted: 13 Aug 2025
Jae-Myeong Shin, Seongi Lee, Jong-Sung Lee, Dong Hyeon Kim, Eun-chae Jeon, Young-Chang Joo, So-Yeon Lee and Byoung-Joon Kim
Tech University of Korea, Seoul National University, Seoul National University, University of Ulsan, University of Ulsan, Seoul National University, Kumoh National Institute of Technology (KIT) and Tech University of Korea
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Abstract:

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Cu-Mn alloy, flexible interconnect, self-forming layer, bending fatigue, interfacial adhesion