Ju-Won Jun

Tech University of Korea

Korea

Learn more about SSRN Profiles

SCHOLARLY PAPERS

1

DOWNLOADS

56

TOTAL CITATIONS

0

Feedback

Scholarly Papers (1)

Sort by:

Actions:

View:
Selected
Original List
All Versions Hide All Versions
All Abstracts Hide All Abstracts

(Rank)

1.

Cuag Alloy-Driven Low-Temperature Bonding for Advanced 3d Packaging

Number of pages: 12 Posted: 10 May 2025

Ju-Won Jun, Seng-Hyuk Lee, Yong-Kyu Lee, Yong Ho Ko, Chang Woo Byun, Hee-Soo Kim, So-Yeon Lee and Byoung-Joon Kim

Tech University of Korea, Tech University of Korea, Tech University of Korea, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Kumoh National Institute of Technology (KIT) and Tech University of Korea

Downloads 56 (1,000,027)

Abstract:

Feedback

All content on this site: Copyright © 2026 Elsevier Inc., its licensors, and contributors. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For all open access content, the relevant licensing terms apply.

We use cookies to help provide and enhance our service and tailor content.

To learn more, visit .