Bozhou Cai

Kyushu University

6-19-1, Hakozaki, Higashiku

Fukuoka, 812-8581

Japan

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Study on Dislocation Propagation in 300-Mm Si Wafer During a High Thermal Budget Process

Number of pages: 30 Posted: 22 May 2025

Jiuyang Yuan, Bozhou Cai, Yoshiji Miyamura, Wataru Saito and Shin-ichi Nishizawa

Kyushu University, Kyushu University, Kyushu University, Kyushu University and Kyushu University

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