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Tiancai Tan

Dalian University of Technology

Huiying Rd

DaLian, LiaoNing, 116024

China

SCHOLARLY PAPERS

1

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36

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0

Scholarly Papers (1)

1.

Analytical Mechanical Model of Grinding-Induced Warpage in Open Cylindrical Thin-Shell Mirrors

Number of pages: 61 Posted: 13 Jun 2025
Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology and Dalian University of Technology
Downloads 36 (1,263,436)

Abstract:

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Silicon mirror, Grinding, Residual stress, Warpage, Cylindrical shell, computational mechanics