Huiying Rd
DaLian, LiaoNing, 116024
China
Dalian University of Technology
silicon, Grinding, Lapping, Surface morphology, Subsurface damage, Material removal
silicon carbide, molecular dynamics, single grit cutting, deformation, crack initiation
Ultrasonic elliptical vibration cutting, tungsten heavy alloy, Surface quality, Finite element method, Strain rate
Cf/SiC composits, femtosecond laser, Multi-layer cutting, groove
RB-SiC, femtosecond laser, Threshold fluence, Ablation crater, Ablation mechanism
RB-SiC, laser, Ceramic, Composites
Honeycomb measurement, Form error evaluation, Discontinuous surface measurement, Noise removal of discontinuous surface
Keywords: deep cryogenic treatment, ultrasonic vibration, Mechanical properties, Residual stress
Silicon mirror, Grinding, Residual stress, Warpage, Cylindrical shell, computational mechanics
Cast superalloy K4169, Ultrasonic assisted milling, Surface integrity, Surface microstructure
Chemo-mechanical grinding, silicon, mechanical effect, subsurface damage, stress distribution
SiCf/SiC composites, Inclined hole, Femtosecond laser rotary drilling, Inclined helix trajectory
SiCf/SiC composites, Ultrasonic-assisted grinding, Tool wear mechanism, Tribological analysis
Helical milling, Orbital drilling, Hole diameter deviation, Cutting force, Milling strategy, Dimensional quality
Single crystal diamond, chemical mechanical polishing, Archimedes optimization algorithm, Roughness prediction model
Silicon, grinding, material removal uniformity model, grind-polishing wheel
Inconel 718, Ultrasonic vibration-assisted face grinding, Residual stress, High-temperature fatigue, molecular dynamics
