default author photo

Zhaoqiang Zhang

Dalian University of Technology

Huiying Rd

DaLian, LiaoNing, 116024

China

SCHOLARLY PAPERS

1

DOWNLOADS

18

TOTAL CITATIONS

0

Scholarly Papers (1)

1.

Modeling of Material Removal Uniformity in Silicon Wafer Using Nonwoven Structured Grind-Polishing Wheel

Number of pages: 29 Posted: 08 Aug 2025
Yu Zhang, Zhaoqiang Zhang, Renke Kang, Xiaoguang Guo and Shang Gao
Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology and Dalian University of Technology
Downloads 18 (1,491,251)

Abstract:

Loading...

Silicon, grinding, material removal uniformity model, grind-polishing wheel