default author photo

Yu Zhang

Dalian University of Technology

Huiying Rd

DaLian, LiaoNing, 116024

China

SCHOLARLY PAPERS

2

DOWNLOADS

50

TOTAL CITATIONS

0

Scholarly Papers (2)

1.

Mechanical Effect of Abrasives on Material Removal and Subsurface Damage in Chemo-Mechanical Grinding for Silicon

Number of pages: 30 Posted: 30 Mar 2023
Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology and Dalian University of Technology
Downloads 33 (1,277,121)

Abstract:

Loading...

Chemo-mechanical grinding, silicon, mechanical effect, subsurface damage, stress distribution

2.

Modeling of Material Removal Uniformity in Silicon Wafer Using Nonwoven Structured Grind-Polishing Wheel

Number of pages: 29 Posted: 08 Aug 2025
Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology and Dalian University of Technology
Downloads 17 (1,491,251)

Abstract:

Loading...

Silicon, grinding, material removal uniformity model, grind-polishing wheel