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Tae-Ik Lee

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Capillary-Driven Solder Climbing on Au-Finished SMT Components with Anisotropic Surface Texture During Reflow

Number of pages: 35 Posted: 30 Sep 2025
Jeehoo Na, YehRi Kim, Jongbeom Im, Byeongkil Kang, Doo Chan Jung, Dongjin Kim and Tae-Ik Lee
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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Solder climbing, semiconductor package, surface mount technology, capillary effect, Au-finish, surface texture