Author Page for YehRi Kim

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Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers Onto Copper Substrates

Number of pages: 39 Posted: 27 Feb 2024

YehRi Kim, Seoah Kim, Zheng Zhang, Chuantong Chen, Katsuaki Suganuma, Byeong Kwon Ju and Dongjin Kim

affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, Korea University and affiliation not provided to SSRN

Downloads 66 (907,769)

Abstract:

Influence of Pre-Activated Silver Hillocks and Copper Diffusion on Silver Sinter Joining in Sic Power Modules for Direct Cooling Applications: Will the High Specific Surface Area of Pre-Made Hillocks Improve Bonding Strength?

Number of pages: 15 Posted: 12 Jun 2025

YehRi Kim and Dongjin Kim

affiliation not provided to SSRN and affiliation not provided to SSRN

Downloads 46 (1,133,231)

Abstract:

Capillary-Driven Solder Climbing on Au-Finished SMT Components with Anisotropic Surface Texture During Reflow

Number of pages: 35 Posted: 30 Sep 2025

Jeehoo Na, YehRi Kim, Jongbeom Im, Byeongkil Kang, Doo Chan Jung, Dongjin Kim and Tae-Ik Lee

affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN

Downloads 30 (1,332,057)

YehRi Kim

affiliation not provided to SSRN

3

142

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Scholarly Papers (3)

Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers Onto Copper Substrates

Abstract:

Influence of Pre-Activated Silver Hillocks and Copper Diffusion on Silver Sinter Joining in Sic Power Modules for Direct Cooling Applications: Will the High Specific Surface Area of Pre-Made Hillocks Improve Bonding Strength?

Abstract:

Capillary-Driven Solder Climbing on Au-Finished SMT Components with Anisotropic Surface Texture During Reflow

Abstract:

YehRi Kim

affiliation not provided to SSRN

3

142

0

Scholarly Papers (3)

Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers Onto Copper Substrates

Abstract:

Influence of Pre-Activated Silver Hillocks and Copper Diffusion on Silver Sinter Joining in Sic Power Modules for Direct Cooling Applications: Will the High Specific Surface Area of ​​Pre-Made Hillocks Improve Bonding Strength?

Abstract:

Capillary-Driven Solder Climbing on Au-Finished SMT Components with Anisotropic Surface Texture During Reflow

Abstract:

Influence of Pre-Activated Silver Hillocks and Copper Diffusion on Silver Sinter Joining in Sic Power Modules for Direct Cooling Applications: Will the High Specific Surface Area of Pre-Made Hillocks Improve Bonding Strength?