Chuantong Chen

The University of Osaka - Flexible 3D System Integration Laboratory

SCHOLARLY PAPERS

11

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391

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Scholarly Papers (11)

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1.

Development of Robust Oxidation-Free Cu-Cu Direct Bonding with Micron-Sized Cu–Ag Salt Composite Paste and Deterioration Mechanism During Aging and Power Cycling

Number of pages: 26 Posted: 21 Sep 2022
Chuantong Chen, Dongjin Kim, Yang Liu, Ran Liu, Zheng Zhang, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu and Katsuaki Suganuma
The University of Osaka - Flexible 3D System Integration Laboratory, affiliation not provided to SSRN, The University of Osaka, The University of Osaka, The University of Osaka, Toppan Forms CO., LTD - Central Research Center, Northwestern Polytechnic University (NPU), Northwestern Polytechnic University (NPU), Loughborough University, Loughborough University and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 92 (616,975)

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Direct Cu bonding, sintering, Cu-Ag composite paste, anti-oxidation, SiC electronic packaging, high temperature reliability

2.

Development of Micron-Sized Cu–Ag Composite Paste for Oxidation-Free Bare Cu Bonding in Air Condition and its Deterioration Mechanism During Aging and Power Cycling Tests

Number of pages: 30 Posted: 01 Mar 2023
Chuantong Chen, Dongjin Kim, Yang Liu, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu and Katsuaki Suganuma
The University of Osaka - Flexible 3D System Integration Laboratory, affiliation not provided to SSRN, The University of Osaka, Toppan Forms CO., LTD - Central Research Center, Northwestern Polytechnic University (NPU), Northwestern Polytechnic University (NPU), Loughborough University, Loughborough University and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 51 (852,434)

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Direct Cu bonding, Cu-Ag composite paste, anti-oxidation, SiC electronic packaging, high temperature reliability, power cycling

3.

Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers Onto Copper Substrates

Number of pages: 39 Posted: 27 Feb 2024
YehRi Kim, Seoah Kim, Zheng Zhang, Chuantong Chen, Katsuaki Suganuma, Byeong Kwon Ju and Dongjin Kim
affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, Korea University and affiliation not provided to SSRN
Downloads 48 (876,933)

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Ag hillock, Ag plating, Ag-Cu diffusion, SiC, GaN

4.

Development of 10µm-Sized Cu-Ag Composite Paste for Large Area and Robust Bare Cu Bonding in Low Temperature Low Pressure Air Conditions

Number of pages: 10 Posted: 18 Oct 2022
Chuantong Chen, Luobin Zhang, Shuaijie Zhao, Takuya Sekiguchi, Mingyu Li and Katsuaki Suganuma
The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, Toppan Forms CO., LTD - Central Research Center, Harbin Institute of Technology - Sauvage Laboratory for Smart Materials and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 45 (902,929)

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Cu-Ag composite paste, bare Cu bonding, anti-oxidation, sintering, microelectronics packaging

5.

Low Temperature Sintering Mechanism of Mod Assisted Ag Paste for Power Electronics: Experiment and Molecular Dynamic Study

Number of pages: 33 Posted: 24 Oct 2024
Li Liu, Ma Haojie, Chuantong Chen, Xu Zixuan, Nong Liting, Zou Yiwen, Xu Xiyu, Xuanguo Wang and Zhiwen Chen
Wuhan University of Technology, Wuhan University of Technology, The University of Osaka - Flexible 3D System Integration Laboratory, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology and Wuhan University
Downloads 35 (999,661)

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Power Electronics, MOD Additives, Low Temperature Sintering, Micron Silver Paste

6.

Development of Crack-Less and Deformation-Resistant Electroplated Ni/Electroless Ni/Pt/Ag Metallization Layers for Ag-Sintered Joint During a Harsh Thermal Shock

Number of pages: 44 Posted: 25 Jun 2022
Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takehsi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda and Katsuaki Suganuma
The University of Osaka, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka, affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka, The University of Osaka - Joining and Welding Research Institute, affiliation not provided to SSRN and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 35 (999,661)

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Ag-sinter joint, Coating technology, Thermal shock test, Deformation-resistant, Interface evolution.

7.

Size Effect of Nickel-Based Single Crystal Superalloy Revealed by Dynamic Nanoindentation

Number of pages: 26 Posted: 12 Sep 2022
Xu Long, Ziyi Shen, Ming Liu, Yutai Su and Chuantong Chen
Northwestern Polytechnic University (NPU), Northwestern Polytechnic University (NPU), Fuzhou University, Northwestern Polytechnic University (NPU) and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 26 (1,100,767)

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nanoindentation, Dynamic behavior, Size effect, Single crystal superalloy, Hardness

8.

Low Temperature Sintering Mechanism of MOD-Assisted Ag Paste for Power Electronics: Experiment and Molecular Dynamic Study

Number of pages: 27 Posted: 18 Dec 2024
Li Liu, Ma Haojie, Chuantong Chen, Xu Zixuan, Yiwen Zou, Nong Liting, Xu Xiyu, Xuanguo Wang and Zhiwen Chen
Wuhan University of Technology, Wuhan University of Technology, The University of Osaka - Flexible 3D System Integration Laboratory, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology and Wuhan University
Downloads 20 (1,174,200)

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Power Electronics, MOD Additives, Low Temperature Sintering, Micro-Ag Paste

9.

Study on Sintering Parameters and Bonding Mechanism of Cu@Ag Preform Via Electromagnetic Compaction for Power Electronics

Number of pages: 42 Posted: 19 Feb 2025
Li Liu, Qian Wang, Stuart Robertson, Chuantong Chen, Changqing Liu, Zhaoxia Zhou, Chengjiong Tuo, Ma Haojie, Nong Liting, Xueqiang Cao and Zhiwen Chen
Wuhan University of Technology, Wuhan University of Technology, Loughborough University - Loughborough Materials Characterisation Centre, The University of Osaka - Flexible 3D System Integration Laboratory, Loughborough University, Loughborough University - Loughborough Materials Characterisation Centre, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology - State Key Laboratory of Silicate Materials for Architectures and Wuhan University
Downloads 16 (1,222,835)

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Cu@Ag core-shell, low-temperature sintering, stress-assisted bonding mechanism, electromagnetic compaction, molecular dynamics simulation

10.

Enhanced Microstructure and Mechanical Property of Large-Area Nano-Ag Joints by Porous Cu Foam at Low Temperature

Number of pages: 34 Posted: 12 Nov 2024
Wei Liu, Lingzhu Xie, Ma Haojie, Chuantong Chen, Dawei Han, Qian Wang, Zou Yiwen, Zhiwen Chen and Li Liu
Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, The University of Osaka - Flexible 3D System Integration Laboratory, Wuhan University of Technology, Wuhan University of Technology, Wuhan University of Technology, Wuhan University and Wuhan University of Technology
Downloads 12 (1,268,259)

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Large-area bonding, Copper foam, Nano-Ag paste, Low-temperature sintering, power electronics.

11.

Effects of Ni Addition and Bath Temperatures on Electroless Cu Microstructure in Microvia Preparation for Hdi Substrate

Number of pages: 29 Posted: 26 Jun 2024
Zheng Zhang, Ming-Chun Hsieh, Masahiko Nishijima, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hiroki Seto, Kei Hashizume, Yuhei Kitahara, Haruki Nagamura and Katsuaki Suganuma
The University of Osaka, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka - Flexible 3D System Integration Laboratory, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 11 (1,278,497)

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electroless Cu deposition, Microstructure, nanovoids, hydrogen bubbles, TEM observations