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Hiroshi Yoshida

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Effects of Ni Addition and Bath Temperatures on Electroless Cu Microstructure in Microvia Preparation for Hdi Substrate

Number of pages: 29 Posted: 26 Jun 2024
Zheng Zhang, Ming-Chun Hsieh, Masahiko Nishijima, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hiroki Seto, Kei Hashizume, Yuhei Kitahara, Haruki Nagamura and Katsuaki Suganuma
The University of Osaka, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka - Flexible 3D System Integration Laboratory, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and The University of Osaka - Flexible 3D System Integration Laboratory
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Abstract:

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electroless Cu deposition, Microstructure, nanovoids, hydrogen bubbles, TEM observations