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Katsuaki Suganuma

The University of Osaka - Flexible 3D System Integration Laboratory

SCHOLARLY PAPERS

6

DOWNLOADS

359

TOTAL CITATIONS

0

Scholarly Papers (6)

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1.

Development of Robust Oxidation-Free Cu-Cu Direct Bonding with Micron-Sized Cu–Ag Salt Composite Paste and Deterioration Mechanism During Aging and Power Cycling

Number of pages: 26 Posted: 21 Sep 2022
Chuantong Chen, Dongjin Kim, Yang Liu, Ran Liu, Zheng Zhang, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu and Katsuaki Suganuma
The University of Osaka - Flexible 3D System Integration Laboratory, affiliation not provided to SSRN, The University of Osaka, The University of Osaka, The University of Osaka, Toppan Forms CO., LTD - Central Research Center, Northwestern Polytechnic University (NPU), Northwestern Polytechnic University (NPU), Loughborough University, Loughborough University and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 107 (659,652)

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Direct Cu bonding, sintering, Cu-Ag composite paste, anti-oxidation, SiC electronic packaging, high temperature reliability

2.

Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers Onto Copper Substrates

Number of pages: 39 Posted: 27 Feb 2024
YehRi Kim, Seoah Kim, Zheng Zhang, Chuantong Chen, Katsuaki Suganuma, Byeong Kwon Ju and Dongjin Kim
affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, Korea University and affiliation not provided to SSRN
Downloads 66 (907,769)

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Ag hillock, Ag plating, Ag-Cu diffusion, SiC, GaN

3.

Development of 10µm-Sized Cu-Ag Composite Paste for Large Area and Robust Bare Cu Bonding in Low Temperature Low Pressure Air Conditions

Number of pages: 10 Posted: 18 Oct 2022
Chuantong Chen, Luobin Zhang, Shuaijie Zhao, Takuya Sekiguchi, Mingyu Li and Katsuaki Suganuma
The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, Toppan Forms CO., LTD - Central Research Center, Harbin Institute of Technology - Sauvage Laboratory for Smart Materials and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 63 (933,592)

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Cu-Ag composite paste, bare Cu bonding, anti-oxidation, sintering, microelectronics packaging

4.

Development of Micron-Sized Cu–Ag Composite Paste for Oxidation-Free Bare Cu Bonding in Air Condition and its Deterioration Mechanism During Aging and Power Cycling Tests

Number of pages: 30 Posted: 01 Mar 2023
Chuantong Chen, Dongjin Kim, Yang Liu, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu and Katsuaki Suganuma
The University of Osaka - Flexible 3D System Integration Laboratory, affiliation not provided to SSRN, The University of Osaka, Toppan Forms CO., LTD - Central Research Center, Northwestern Polytechnic University (NPU), Northwestern Polytechnic University (NPU), Loughborough University, Loughborough University and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 60 (961,006)

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Direct Cu bonding, Cu-Ag composite paste, anti-oxidation, SiC electronic packaging, high temperature reliability, power cycling

5.

Development of Crack-Less and Deformation-Resistant Electroplated Ni/Electroless Ni/Pt/Ag Metallization Layers for Ag-Sintered Joint During a Harsh Thermal Shock

Number of pages: 44 Posted: 25 Jun 2022
Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takehsi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda and Katsuaki Suganuma
The University of Osaka, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka, affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka, The University of Osaka - Joining and Welding Research Institute, affiliation not provided to SSRN and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 41 (1,170,409)

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Ag-sinter joint, Coating technology, Thermal shock test, Deformation-resistant, Interface evolution.

6.

Effects of Ni Addition and Bath Temperatures on Electroless Cu Microstructure in Microvia Preparation for Hdi Substrate

Number of pages: 29 Posted: 26 Jun 2024
Zheng Zhang, Ming-Chun Hsieh, Masahiko Nishijima, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hiroki Seto, Kei Hashizume, Yuhei Kitahara, Haruki Nagamura and Katsuaki Suganuma
The University of Osaka, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka - Flexible 3D System Integration Laboratory, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 22 (1,424,331)

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electroless Cu deposition, Microstructure, nanovoids, hydrogen bubbles, TEM observations