default author photo

Yukinori Oda

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

1

DOWNLOADS

41

TOTAL CITATIONS

0

Scholarly Papers (1)

Actions:
Email selected abstracts
1.

Development of Crack-Less and Deformation-Resistant Electroplated Ni/Electroless Ni/Pt/Ag Metallization Layers for Ag-Sintered Joint During a Harsh Thermal Shock

Number of pages: 44 Posted: 25 Jun 2022
Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takehsi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda and Katsuaki Suganuma
The University of Osaka, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka, affiliation not provided to SSRN, affiliation not provided to SSRN, The University of Osaka, The University of Osaka - Joining and Welding Research Institute, affiliation not provided to SSRN and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads 41 (1,170,409)

Abstract:

Loading...

Ag-sinter joint, Coating technology, Thermal shock test, Deformation-resistant, Interface evolution.