Skip to main content
Feedback to SSRN
Feedback
(required)
Email
(required)
Submit
Shuaijie Zhao
The University of Osaka - Flexible 3D System Integration Laboratory
Learn more about SSRN Profiles
SCHOLARLY PAPERS
1
DOWNLOADS
63
TOTAL CITATIONS
0
Feedback
Scholarly Papers (1)
Sort by:
Paper Title, A-Z
Paper Title, Z-A
Author Name, A-Z
Author Name, Z-A
Date Posted, Ascending
Date Posted, Descending
Downloads, Ascending
Downloads, Descending
Citations, Ascending
Citations, Descending
Actions:
Email selected abstracts
View:
Selected
Original List
All Versions
Hide All Versions
All Abstracts
Hide All Abstracts
(Rank)
1.
Development of 10µm-Sized Cu-Ag Composite Paste for Large Area and Robust Bare Cu Bonding in Low Temperature Low Pressure Air Conditions
Number of pages: 10
Posted: 18 Oct 2022
Chuantong Chen
,
Luobin Zhang
, Shuaijie Zhao,
Takuya Sekiguchi
,
Mingyu Li
and
Katsuaki Suganuma
The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, The University of Osaka - Flexible 3D System Integration Laboratory, Toppan Forms CO., LTD - Central Research Center, Harbin Institute of Technology - Sauvage Laboratory for Smart Materials and The University of Osaka - Flexible 3D System Integration Laboratory
Downloads
63
(933,592)
View PDF
Download
Abstract:
Cu-Ag composite paste, bare Cu bonding, anti-oxidation, sintering, microelectronics packaging
Feedback
