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CaiXia Lei

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

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Scholarly Papers (1)

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Hydrogen-Bond Mediated Molecular Assembly of BTA/DEA Enables Dense Interfacial Films for Electrically Uniform Ag/Cu Contacts

Number of pages: 38 Posted: 26 Nov 2025
Jingqi Chen, Juan Zuo, Jieying Wang, Li Zhang, Xinyi Fan, CaiXia Lei and Deli Shen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology
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Abstract:

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Ag/Cu composite； AgSnO2In2O3 rivet-type contacts； BTA； DEA； corrosion inhibition