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Mengjia wang

Shanghai University of Electric Power

Shanghai

China

  • Shanghai University of Electric Power

SCHOLARLY PAPERS

2

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75

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Scholarly Papers (2)

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1.

Unraveling the Defect-Free Blind-hole Filling Mechanism in PCBs by a Dual-Functional Monocomponent Additive: In Situ Molecular Spectroscopy and DFT Validation

Number of pages: 31 Posted: 17 Dec 2025
Tianmin wang, Hang Zhang, Bowen chang, Mengjia wang, Mingui Li, Xixun Shen, Qunjie Xu and Qiaoxia Li
Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power and Shanghai University of Electric Power
Downloads 39 (1,222,651)

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Blind-hole electroplating, Copper, Single additive, 2-Mercapto-1-methylimidazole, mechanism

2.

Three-dimensional network binder achieves strong adhesion and rapid lithium-ion transport for Practical Si/C Composite Electrode

Number of pages: 26 Posted: 12 Dec 2025
Bowen chang, Yuan xiao, Tianmin wang, Mengjia wang, Mingui Li, Fu Ming Wang, Qunjie Xu and Qiaoxia Li
Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, National Taiwan University of Science and Technology, Shanghai University of Electric Power and Shanghai University of Electric Power
Downloads 36 (1,249,711)

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Polymer binders, Lithium-ion batteries, Si/C electrodes, strong adhesion