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Hang Zhang

Shanghai University of Electric Power

Shanghai

China

  • Shanghai University of Electric Power

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Unraveling the Defect-Free Blind-hole Filling Mechanism in PCBs by a Dual-Functional Monocomponent Additive: In Situ Molecular Spectroscopy and DFT Validation

Number of pages: 31 Posted: 17 Dec 2025
Tianmin wang, Hang Zhang, Bowen chang, Mengjia wang, Mingui Li, Xixun Shen, Qunjie Xu and Qiaoxia Li
Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power, Shanghai University of Electric Power and Shanghai University of Electric Power
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Blind-hole electroplating, Copper, Single additive, 2-Mercapto-1-methylimidazole, mechanism