Yingxin Cui

Shandong University

27 Shanda Nanlu

South Rd.

Jinan, SD 250100

China

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Effects of wire bonding pressure and solder material on the reliability of TO-247 packaged SiC MOSFET under power cycling

Number of pages: 20 Posted: 09 Jan 2026

Shoulai Gong, Fanpeng Zeng, Yingxin Cui, Kuan Yew Cheong, Yanao Guo and Jisheng Han

Shandong University, Shandong University, Shandong University, Universiti Sains Malaysia (USM), Shandong University and Shandong University

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