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Zhenliang Pan
University of California, Los Angeles (UCLA)
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SCHOLARLY PAPERS
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Scholarly Papers (1)
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1.
Microstructural Evolution of Nanotwinned Copper in Confined High-Aspect-Ratio Through-Silicon Via Geometries
Number of pages: 10
Posted: 20 Jan 2026
Yuchen Bao
, Zhenliang Pan and
Tiwei Wei
University of California, Los Angeles (UCLA), University of California, Los Angeles (UCLA) and University of California, Los Angeles (UCLA)
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Abstract:
Nanotwinned copper, Grain growth, Twin boundaries, Through-silicon vias, Thermal annealing
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