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Tiwei Wei

University of California, Los Angeles (UCLA)

Stanford University

367 Panama St

Stanford, CA 94305

United States

  • Stanford University

SCHOLARLY PAPERS

2

DOWNLOADS

155

TOTAL CITATIONS

2

Scholarly Papers (2)

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1.

Design Optimization and Performance Pareto Front Development of a Multi-Level 3d Manifolded Extreme Heat Flux Cooler Via Reduced Order Numerical Modeling

Number of pages: 33 Posted: 27 May 2022
Sougata Hazra, Tiwei Wei, Yujui Lin, Mehdi Asheghi, Kenneth Goodson, Man Prakash Gupta and Michael Degner
Stanford University, University of California, Los Angeles (UCLA), Stanford University, Stanford University, Stanford University, Ford Motor Company and Ford Motor Company
Downloads 92 (747,755)
Citation 2

Abstract:

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Extreme Heat Flux Cooling, 3D Manifold Micro-Cooler, Reduced Order Models, Pareto Optimal Front, optimization, Numerical modeling, Embedded Cooling, Packaging, Microchannels

2.

Microstructural Evolution of Nanotwinned Copper in Confined High-Aspect-Ratio Through-Silicon Via Geometries

Number of pages: 10 Posted: 20 Jan 2026
Yuchen Bao, Zhenliang Pan and Tiwei Wei
University of California, Los Angeles (UCLA), University of California, Los Angeles (UCLA) and University of California, Los Angeles (UCLA)
Downloads 63 (933,592)

Abstract:

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Nanotwinned copper, Grain growth, Twin boundaries, Through-silicon vias, Thermal annealing