default author photo

Man Prakash Gupta

Ford Motor Company

1 American Road, 233

Dearborn, MI 48121

United States

  • Ford Motor Company

SCHOLARLY PAPERS

3

DOWNLOADS

253

TOTAL CITATIONS

2

Scholarly Papers (3)

Actions:
Email selected abstracts
1.

Design Optimization and Performance Pareto Front Development of a Multi-Level 3d Manifolded Extreme Heat Flux Cooler Via Reduced Order Numerical Modeling

Number of pages: 33 Posted: 27 May 2022
Sougata Hazra, Tiwei Wei, Yujui Lin, Mehdi Asheghi, Kenneth Goodson, Man Prakash Gupta and Michael Degner
Stanford University, University of California, Los Angeles (UCLA), Stanford University, Stanford University, Stanford University, Ford Motor Company and Ford Motor Company
Downloads 92 (747,755)
Citation 2

Abstract:

Loading...

Extreme Heat Flux Cooling, 3D Manifold Micro-Cooler, Reduced Order Models, Pareto Optimal Front, optimization, Numerical modeling, Embedded Cooling, Packaging, Microchannels

2.

Development of Capillary-based Two-phase Microcooler Using Laser-fabricated Hierarchical Silicon Pin-Fin/Microchannel Wick

Number of pages: 15 Posted: 24 Oct 2025
Yujui Lin, Heungdong Kwon, Kewei Xiao, Man Prakash Gupta, Michael Degner, H. Alan Mantooth, Mehdi Asheghi and Kenneth Goodson
Stanford University, Stanford University, affiliation not provided to SSRN, Ford Motor Company, Ford Motor Company, University of Arkansas, Stanford University and Stanford University
Downloads 89 (803,225)

Abstract:

Loading...

Embedded cooler, Two-phase cooling, Capillary-driven liquid film boiling, Boiling visualization

3.

Fabrication Feasibility Study and Techno–Economic Analysis of Scaling Up All Silicon 2–Level Manifolded Micro-Coolers to Extreme Footprint Area (> 600 Mm2)

Number of pages: 50 Posted: 04 Jul 2023
Sougata Hazra, Yujui Lin, Mehdi Asheghi, Kenneth Goodson, Man Prakash Gupta and Michael Degner
Stanford University, Stanford University, Stanford University, Stanford University, Ford Motor Company and Ford Motor Company
Downloads 72 (875,328)

Abstract:

Loading...

Coolers, Microchannel, Manifold, 3D, fabrication, etching, DRIE, ARDE, heater design, scale up, TEA, feasibility, Manufacturing, electronics cooling, high heat flux