367 Panama St
Stanford, CA 94305
United States
Stanford University
Extreme Heat Flux Cooling, 3D Manifold Micro-Cooler, Reduced Order Models, Pareto Optimal Front, optimization, Numerical modeling, Embedded Cooling, Packaging, Microchannels
Coolers, Microchannel, Manifold, 3D, fabrication, etching, DRIE, ARDE, heater design, scale up, TEA, feasibility, Manufacturing, electronics cooling, high heat flux
Capillary, wicking, transport, vapor chambers, heat pipes, hybrid, UV-laser