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Formation of High-Density Stacking Faults in Ceramic Films Induced by Ti Transition Layer

11 Pages Posted: 8 Dec 2021 Publication Status: Published

See all articles by Yanmeng Chen

Yanmeng Chen

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Tao Guo

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Xiaolu Pang

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering; University of Science and Technology Beijing - Department of Material Physics and Chemistry

Lijie Qiao

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Abstract

Stacking faults and twins are extremely difficult to form in ceramic materials. At the same time, previous studies often used the metal transition layer to improve the film-substrate bonding force, but ignored its influence on the film structure and mechanical properties. Our research shows that a large number of stacking faults are formed in the Ti transition layer grown on (110) MgO substrate, which induces high density tacking faults in nitride ceramic films with high stacking fault energy, thereby increasing the nanoindentation hardness of the ceramic film. Whether the stacking faults in the Ti transition layer can enter the ceramic films depends on the stacking fault density. This work is of great significance for studying how to induce the formation of stacking faults and twins in ceramics with high stacking fault energy to improve the mechanical properties.

Keywords: Ceramic thin films, stacking faults, Transition layer, hardness, Microstructure

Suggested Citation

Chen, Yanmeng and Guo, Tao and Pang, Xiaolu and Qiao, Lijie, Formation of High-Density Stacking Faults in Ceramic Films Induced by Ti Transition Layer. Available at SSRN: https://ssrn.com/abstract=3980346 or http://dx.doi.org/10.2139/ssrn.3980346

Yanmeng Chen

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Beijing
China

Tao Guo

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering ( email )

30 Xueyuan Road, Haidian District
Beijing, 100083
China

Xiaolu Pang (Contact Author)

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering

Beijing
China

University of Science and Technology Beijing - Department of Material Physics and Chemistry ( email )

Beijing
China

Lijie Qiao

University of Science and Technology Beijing - Beijing Advanced Innovation Center for Materials Genome Engineering ( email )

30 Xueyuan Road, Haidian District
Beijing, 100083
China

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