Porous Silicon Decorated with Copper Particles for Bimodal Detection of Dimethylmethylphosphonate by Ft-Ir and Mass Spectrometry

12 Pages Posted: 28 Apr 2023

See all articles by Warda Raiah

Warda Raiah

Ecole Centrale d'Electronique (ECE)

Mohammed Guendouz

Univ Rennes, CNRS, CREM - UMR6211, F-35000 Rennes France

Parastesh Pirasteh

Univ Rennes, CNRS, CREM - UMR6211, F-35000 Rennes France

Vincent Thomy

University of Lille

Joel charrier

Univ Rennes, CNRS, CREM - UMR6211, F-35000 Rennes France

Yannick Coffinier

Ecole Centrale d'Electronique (ECE)

Abstract

The release of organophosphates into the natural environment may directly and indirectly affect human health and cause severe damage to environmental ecosystems, thus raising global concern. In addition, some of these organophosphorus compounds (OPs) have been weaponized and already used as massive chemical weapons. So, in this study we propose the development of a new nanomaterial based on porous silicon (PSi) decorated with copper particles for the detection of dimethyl methylphosphonate (DMMP), a sarin simulant. We took advantage of the large surface area of PSi and the specificity towards DMMP brought by copper particle decoration. By assessing two types of PSi (60% and 80% porosity), we performed a systematic study to find the best experimental copper particle deposition method to ensure a uniform distribution within porous texturation. Then, and for the first time, the presence of DMMP was detected bimodally using FT-IR and mass spectrometry from the same PSi-Cu surface.

Keywords: Porous Silicon, dimethylmethylphosphonate, copper particles, FT-IR, Mass spectrometry, bimodal detection

Suggested Citation

Raiah, Warda and Guendouz, Mohammed and Pirasteh, Parastesh and Thomy, Vincent and charrier, Joel and Coffinier, Yannick, Porous Silicon Decorated with Copper Particles for Bimodal Detection of Dimethylmethylphosphonate by Ft-Ir and Mass Spectrometry. Available at SSRN: https://ssrn.com/abstract=4431590 or http://dx.doi.org/10.2139/ssrn.4431590

Warda Raiah

Ecole Centrale d'Electronique (ECE) ( email )

Mohammed Guendouz

Univ Rennes, CNRS, CREM - UMR6211, F-35000 Rennes France ( email )

Parastesh Pirasteh

Univ Rennes, CNRS, CREM - UMR6211, F-35000 Rennes France ( email )

Vincent Thomy

University of Lille ( email )

Joel Charrier

Univ Rennes, CNRS, CREM - UMR6211, F-35000 Rennes France ( email )

Yannick Coffinier (Contact Author)

Ecole Centrale d'Electronique (ECE) ( email )

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