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Microstructural Equivalency between Bending and Uniaxial Creep
19 Pages Posted: 29 Apr 2020 Publication Status: Accepted
Abstract
Recently, bending creep has been shown to facilitate the evaluation of creep properties of materials in high throughput fashion. Here, electron back-scattered diffraction analysis was used to observe steady-state substructures formed under bending and uniaxial creep tests. At a given combination of stress and temperature, the sizes of the steady-state sub-grains formed in both the cantilever and the uniaxial test samples were identical. By establishing the microstructural equivalence between bending and uniaxial creep, this study unequivocally validates bending tests for studying the creep response of materials.
Keywords: Bending creep, Creep substructure, High throughput characterization, Steady-state creep microstructure
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