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Meng Han

Shanghai Polytechnic University

Shanghai, 201209

China

  • Shanghai Polytechnic University

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Wide-field quantitative mapping of thermal properties and structural defects at deeply buried interfaces

Number of pages: 16 Posted: 06 Apr 2026
Hang Shi, Xuancheng Li, Ting Liang, Zhibin Wen, Yimin Yao, Jianbin Xu, Rong Sun, Meng Han and Xiaokun Gu
affiliation not provided to SSRN, affiliation not provided to SSRN, The Chinese University of Hong Kong (CUHK), affiliation not provided to SSRN, affiliation not provided to SSRN, The Chinese University of Hong Kong (CUHK), Chinese Academy of Sciences (CAS), Shanghai Polytechnic University and Shanghai Polytechnic University
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Abstract:

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Thermal interface materials, deeply buried interfaces, thermal mapping, structural defects detecting, frequency domain thermoreflectance