Low temperature curable, Photosensitive polyimide, Side group, Alkalinity
Garnet structure, Dodecahedral distortion, Microwave- millimeter-wave dielectric properties, Infrared reflectance spectrum, Terahertz time-domain spectroscopy
Flexible thermoelectric devices, In situ integration, Cu2Se, Ag2Se, Nanosheets array
graphene/graphite films, electrical and thermal transport properties, temperature coefficient of resistance, phase transition
Thermal interface materials, MXene sheets, interfacial heat-transfer, electrostatic self-assembly
Bi2Te3, hot extrusion, Microstructure evolution, Taylor model, Segmented module
Low-frequency FDTR, thermal penetration depth, thermal interface materials, semi-in-situ characterization, interface thermal resistance, thermal conductivity
Covalent organic framework, Anion exchange membrane, Molecular dynamics, Quaternary Ammonium, Ion Diffusion
Silver fractal dendrite, polyvinylidene fluoride, electrical conductivity, Electromagnetic interference shielding, mechanical property
PDMSSuper-StrechabilityAnti-Fatigue, EntanglementCross-linking
Foam, thermal transport, material design
Ultra-thin MLCCs, BaTiO3, Tetragonality, Hydrothermal reaction mechanism, Dielectric Properties
Underfill, epoxy resin, silane coupling agent, hydrothermal aging, molecular dynamics simulation
Thermal conductivity, transient photo-electro-thermal, thermoelectric films, Peltier effect
Laser debonding technology, Monolayer materials, Domain-limiting effect, ablation threshold, Advanced packaging
Epoxy resin, reaction kinetics, Curing Shrinkage, Viscosity, Molecular dynamics, fractal dimension
(InTe, Thermoelectric Performance, grain boundary scattering)
silver halides, electrically conductive adhesives, volume resistivity, percolation threshold
Thermoelectric, Transient supercooling, Power factor, Interface resistance, Overall transient benefit
Silver nanowires, Alumina, Thin films, Stability, Electrical properties, electromagnetic interference shielding
