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Li Gang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

3

DOWNLOADS

95

TOTAL CITATIONS

2

Scholarly Papers (3)

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1.

Systematic Study of the Effect of Silane Coupling Agent on the Hydrothermal Aging Resistance of the Underfill Epoxy Resin and Silica Interface Via Molecular Dynamics Simulation

Number of pages: 21 Posted: 11 Nov 2024
Wei Wang, Xuecheng Yu, Cheng Lai, Li Gang, Pengli Zhu and Rong Sun
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) and Chinese Academy of Sciences (CAS)
Downloads 54 (1,063,489)
Citation 2

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Underfill, epoxy resin, silane coupling agent, hydrothermal aging, molecular dynamics simulation

2.

Significant Enhancement of the Comprehensive Performance of Electrically Conductive Adhesives Using Silver Halides

Number of pages: 8 Posted: 03 Apr 2025
Junhao Liu, Yankang Han, Xuecheng Yu, Hebin Zhang, Li Gang, Rong Sun and Pengli Zhu
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Macau, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) and Chinese Academy of Sciences (CAS)
Downloads 29 (1,372,601)

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silver halides, electrically conductive adhesives, volume resistivity, percolation threshold

3.

Interface Engineering and Air Sintering Mechanism of Bimodal Cu Nanoparticles for High-Performance Interconnects

Number of pages: 13 Posted: 27 May 2026
Binbin Zhou, Yiming Luo, Xianwen Zeng, Kaige Liu, Linlin Mo, Haoyu Zhu, Longbo Li, Chong Wang, xiaowei Liu, Liang Xu, Li Gang, Pengli Zhu and Rong Sun
City University of Hong Kong (CityU), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) and Chinese Academy of Sciences (CAS)
Downloads 12 (1,579,934)

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Surface/interface engineering, Copper Interconnect, bimodal nanoparticle, air sintering, interface evolution