default author photo

Kaige Liu

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

1

DOWNLOADS

10

TOTAL CITATIONS

0

Scholarly Papers (1)

Actions:
Email selected abstracts
1.

Interface Engineering and Air Sintering Mechanism of Bimodal Cu Nanoparticles for High-Performance Interconnects

Number of pages: 13 Posted: 27 May 2026
Binbin Zhou, Yiming Luo, Xianwen Zeng, Kaige Liu, Linlin Mo, Haoyu Zhu, Longbo Li, Chong Wang, xiaowei Liu, Liang Xu, Li Gang, Pengli Zhu and Rong Sun
City University of Hong Kong (CityU), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) and Chinese Academy of Sciences (CAS)
Downloads 10 (1,579,934)

Abstract:

Loading...

Surface/interface engineering, Copper Interconnect, bimodal nanoparticle, air sintering, interface evolution