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Yimin Yao

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

3

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99

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Scholarly Papers (3)

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1.

Semi-in-Situ Thermal Transport Characterization of Thermal Interface Materials Through a Low-Frequency Thermoreflectance Technique

Number of pages: 29 Posted: 28 Jun 2024
Xuancheng Li, Anran Li, Hang Shi, Yimin Yao, Zhenqiang Ye, Zhibin Wen, Linlin Ren, Xiaoliang Zeng, Jianbin Xu, Meng Han and Rong Sun
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Shenzhen University, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS), The Chinese University of Hong Kong (CUHK), affiliation not provided to SSRN and Chinese Academy of Sciences (CAS)
Downloads 52 (1,052,702)

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Low-frequency FDTR, thermal penetration depth, thermal interface materials, semi-in-situ characterization, interface thermal resistance, thermal conductivity

2.

Wide-field quantitative mapping of thermal properties and structural defects at deeply buried interfaces

Number of pages: 16 Posted: 06 Apr 2026
Hang Shi, Xuancheng Li, Ting Liang, Zhibin Wen, Yimin Yao, Jianbin Xu, Rong Sun, Meng Han and Xiaokun Gu
affiliation not provided to SSRN, affiliation not provided to SSRN, The Chinese University of Hong Kong (CUHK), affiliation not provided to SSRN, affiliation not provided to SSRN, The Chinese University of Hong Kong (CUHK), Chinese Academy of Sciences (CAS), Shanghai Polytechnic University and Shanghai Polytechnic University
Downloads 31 (1,359,097)

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Thermal interface materials, deeply buried interfaces, thermal mapping, structural defects detecting, frequency domain thermoreflectance

3.

Poly(ionic liquid) Composites with Liquid Metal-Copper Hybrid Networks for High-Performance Thermal Interface Materials​

Number of pages: 30 Posted: 08 May 2026
Yucheng Jiang, Jianhui Zeng, Longfeng Zou, Taoying Rao, Long Teng, Yilan Guo, Zhengwu Peng, Liejun Li, Rong Sun and Yimin Yao
South China University of Technology, South China University of Technology, affiliation not provided to SSRN, South China University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, South China University of Technology, South China University of Technology, Chinese Academy of Sciences (CAS) and affiliation not provided to SSRN
Downloads 16 (1,509,872)

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Thermal Interface Material, Poly(ionic liquid), Liquid Metal, Copper