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Mingli Geng

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Low-temperature Cu/Al solid-state bonding with SAC307+Zn composite interlayer: achieving robust long-term thermal reliability via ultrasonic-assistance

Number of pages: 28 Posted: 21 Apr 2026
Guisheng Gan, Fangliang Li, Mingli Geng, Jiajun Zhang, Yunfei Du, Donghua Yang and Hao Pan
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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Cu/Al interconnect, ultrasonic-assisted bonding, SAC307+Zn composite layer, thermal reliability, phase transformation