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Donghua Yang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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71

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Scholarly Papers (2)

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1.

Optimizing Imc Orientation and Growth at Co/Sn Interfaces with P Doping for Enhanced Solder Joint Reliability

Downloads 64 (933,592)

Optimizing Imc Orientation and Growth at Co/Sn Interfaces with P Doping for Enhanced Solder Joint Reliability

Number of pages: 18 Posted: 08 Dec 2023
Donghua Yang, Yuqian Chen, Fei Du, Tao Chen, Kailun Hu, Chunhong Zhang, Guisheng Gan, Fancheng Meng and Fuxiang Huang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 46 (1,144,483)

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Interfacial reaction, IMC, Co-P, EBSD analysis, Interface bonding strength

Optimizing Imc Orientation and Growth at Co/Sn Interfaces with P Doping for Enhanced Solder Joint Reliability

Number of pages: 18 Posted: 21 Nov 2023
Donghua Yang, Yuqian Chen, Fei Du, Tao Chen, Kailun Hu, Chunhong Zhang, Guisheng Gan, Fancheng Meng and Fuxiang Huang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 18 (1,525,626)

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Interfacial reaction, IMC, Co-P, EBSD analysis, Interface bonding strength

2.

Low-temperature Cu/Al solid-state bonding with SAC307+Zn composite interlayer: achieving robust long-term thermal reliability via ultrasonic-assistance

Number of pages: 28 Posted: 21 Apr 2026
Guisheng Gan, Fangliang Li, Mingli Geng, Jiajun Zhang, Yunfei Du, Donghua Yang and Hao Pan
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 7 (1,571,455)

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Cu/Al interconnect, ultrasonic-assisted bonding, SAC307+Zn composite layer, thermal reliability, phase transformation