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Hao Pan

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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14

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0

Scholarly Papers (2)

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1.

Synergistic enhancement of interfacial strength and corrosion resistance in CMT-deposited Al/Mg heterogeneous structures via Si addition

Number of pages: 32 Posted: 26 Jun 2026
Xiaoming Nie, Xue Li, Gaoyang Yu, Dezhu Chen, Yizhi Liao, Shuhai Chen, Lize Li, Xueping Ding and Hao Pan
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Science and Technology Beijing, University of Science and Technology Beijing, affiliation not provided to SSRN and affiliation not provided to SSRN
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CMT, Al-Si filler wires, Al/Mg IMCs, Electrochemical corrosion

2.

Low-temperature Cu/Al solid-state bonding with SAC307+Zn composite interlayer: achieving robust long-term thermal reliability via ultrasonic-assistance

Number of pages: 28 Posted: 21 Apr 2026
Guisheng Gan, Fangliang Li, Mingli Geng, Jiajun Zhang, Yunfei Du, Donghua Yang and Hao Pan
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 7 (1,571,455)

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Cu/Al interconnect, ultrasonic-assisted bonding, SAC307+Zn composite layer, thermal reliability, phase transformation