No.219, Ningliu Road
Nanjing, 210094
China
Nanjing University of Science and Technology
3D integrated chip, Micro-fins, through-silicon via (TSV), Electrothermal coupling.
Stepped Oblique-Finned Microchannel, Flow Boiling, Heat Transfer, Pressure Drop, Instability
Vibration condition, solid-solid interface, thermal contact conductance, heat source temperature
Pulsed laser, Phase change thermal storage, Energy supply-demand matching, Pump-driven two-phase flow