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wei he

Nanjing University of Science and Technology

No.219, Ningliu Road

Nanjing, 210094

China

  • Nanjing University of Science and Technology

SCHOLARLY PAPERS

2

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134

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Scholarly Papers (2)

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1.

Study on the Electro-Thermal Coupling of Through Silicon Via and Heat Transfer Performance of Embedded Micro-Fin in a 3d Integrated Chip

Number of pages: 22 Posted: 24 May 2022
wei he, Qiang Li and Dinghua Hu
Nanjing University of Science and Technology, Nanjing University of Science and Technology and Nanjing University of Science and Technology
Downloads 78 (852,604)

Abstract:

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3D integrated chip, Micro-fins, through-silicon via (TSV), Electrothermal coupling.

2.

Study on the Electro-Thermal Coupling of Through Silicon Via and Heat Transfer Performance of Embedded Micro-Fin in a 3d Ic

Number of pages: 19 Posted: 01 Aug 2022
wei he and Qiang Li
Nanjing University of Science and Technology and Nanjing University of Science and Technology
Downloads 56 (1,010,164)

Abstract:

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3D integrated chip, Micro-fins, through-silicon via (TSV), Electrothermal coupling