No.219, Ningliu Road
Nanjing, 210094
China
Nanjing University of Science and Technology
3D integrated chip, Micro-fins, through-silicon via (TSV), Electrothermal coupling.
3D integrated chip, Micro-fins, through-silicon via (TSV), Electrothermal coupling
Pulsed laser, Phase change thermal storage, Energy supply-demand matching, Pump-driven two-phase flow