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Jihyun Lee

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

4

DOWNLOADS

305

TOTAL CITATIONS

2

Scholarly Papers (4)

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1.

Identifying the Weakest Interface in Beol Structures

Number of pages: 37 Posted: 03 Feb 2025
Dong Jun Kim, Sun Woo Lee, Won Choi, Ho Jun Chang, Inhwa Lee, Seungju Park, Jihyun Lee, Joong Jung Kim, Sumin Kang and TaekSoo Kim
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Korea Advanced Institute of Science and Technology (KAIST) - Department of Mechanical Engineering
Downloads 110 (640,165)

Abstract:

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adhesion, BEOL, surface treatment, Dielectric constant, Deposition sequence, Adhesion mapping

2.

Effects of Surface Treatments for the Adhesion Improvement between Cu and Sicn in Beol Interconnect

Number of pages: 20 Posted: 21 May 2024
Dong Jun Kim, Sumin Kang, Sun Woo Lee, Inhwa Lee, Seungju Park, Jihyun Lee, Joong Jung Kim and TaekSoo Kim
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Korea Advanced Institute of Science and Technology (KAIST) - Department of Mechanical Engineering
Downloads 90 (747,755)
Citation 2

Abstract:

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mechanical reliability, interfacial adhesion, surface treatments, crystallographic orientations, alternating crack path, semiconductor device

3.

Role of Loading Mode on Crack Propagation Behavior and Adhesion at Cu–Sicn Interface

Number of pages: 30 Posted: 19 Oct 2024
Dong Jun Kim, Sun Woo Lee, Sihyuk Sung, Inhwa Lee, Seungju Park, Jihyun Lee, Joong Jung Kim, Sumin Kang and TaekSoo Kim
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Korea Advanced Institute of Science and Technology (KAIST) - Department of Mechanical Engineering
Downloads 57 (1,000,027)

Abstract:

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loading mode, crack path, adhesion, surface treatment, fracture test method

4.

Impact of Surface Oxidation on SAC305 Solder Joint Reliability and Oxide Removal Rework Processes

Number of pages: 44 Posted: 17 Feb 2026
Taek-soo Shin, JaeJun Yoon, Minji Kim, Seongho Sim, Kyoungwook Kim, Gilho Gu, Jihyun Lee, Chihoon Lee and seung-boo jung
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 48 (1,236,159)

Abstract:

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Solder oxide layer, Diffusion barrier, Head-in-Pillow defect, High-selectivity chemical etching, Reliability