Icheon
Korea, Republic of
SK hynix Inc
Copper bromide, Room-temperature, Resistive memory, metal halide, Conductive filament (CF)
a-IGZO, contact resistance, Schottky barrier height, Metal-Interlayer-Semiconductor, Oxygen areal density, Plasma treatment
a-IGZO, Contact resistance, AZO, Metal-interlayer-semiconductor, Source/drain contact