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Ke Xie

Shanghai University

149 Yanchang Road

SHANGDA ROAD 99

Shanghai 200072, 200444

China

  • Shanghai University

SCHOLARLY PAPERS

3

DOWNLOADS

121

TOTAL CITATIONS

1

Scholarly Papers (3)

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1.

Integrated Piezoresistive Sensor for High-Precision Closed-Loop Control of Piezoelectric Mems Fast Steering Mirror

Number of pages: 8 Posted: 27 Dec 2024
Zhichao Weng, Wenli Xue, Xingwang Zhu, Mingkun Wang, Yongquan Su, Yi Yang, Liu Yichen, Hao Huang, yanlong wang, Ke Xie, Wang Yang, Hao Chen, Wang Lihao and Wu Zhenyu
Shanghai University, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, affiliation not provided to SSRN, Shanghai University, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology and Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology
Downloads 83 (809,932)
Citation 1

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Integrated PZR sensor, Closed-loop control, Point accuracy, Long-term stability

2.

A Novel Heat-Resistant Vias-First Tsv Silicon Substrate for High Density 2.5d/3d Interposer Application

Number of pages: 8 Posted: 11 Sep 2024
yanlong wang, Yongquan Su, Yichen Liu, Wang Lihao, Zhichao Weng, Ke Xie, Wu Zhenyu and Jihua Zhang
affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Shanghai University, Shanghai University, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology and affiliation not provided to SSRN
Downloads 20 (1,491,251)

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Silicon vias-first TSVDRIEPolymer solution fillingDielectric performance evaluation

3.

A Novel Heat-Resistant Vias-First Tsv Mems Silicon Substrate for High Density 2.5d/3d Interposer Application

Number of pages: 10 Posted: 30 Apr 2025
yanlong wang, Yongquan Su, Liu Yichen, Wang Lihao, Zhichao Weng, Ke Xie, Yi Yang, Jihua Zhang and Wu Zhenyu
affiliation not provided to SSRN, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Shanghai University, Shanghai University, affiliation not provided to SSRN, affiliation not provided to SSRN and Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology
Downloads 18 (1,500,778)

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Silicon vias-first TSVDRIEPolymer solution fillingDielectric performance evaluation