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Xin Yang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Incorporating Negative Thermal Expansion Cu2v2o7 into Epoxy to Achieve Low Thermal Expansion and High Thermal Conductivity

Number of pages: 25 Posted: 19 Nov 2024
Junqi Li, Feiyu Qin, Yiping Lv, Xin Yang, Tianhang Wu, Xiaoling Wang, Wenhui Xu, Nianjie Liu, Lei Hu, Jun Sun and Xiangdong Ding
affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials and Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials
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Electronic packing materials, Epoxy molding compound (EMC), Negative thermal expansion (NTE), Epoxy/NTE composite