Author Page for Lei Hu

Integrating Abnormal Thermal Expansion and Ultralow Thermal Conductivity into (Cd,Ni)2re2o7 Via Synergy of Local Structure Distortion and Soft Acoustic Phonons

Number of pages: 30 Posted: 25 Aug 2023

Feiyu Qin, Lei Hu, Yingcai Zhu, Yuki Sakai, Shogo Kawaguchi, Akihiko Machida, Tetsu Watanuki, Yuewen Fang, Jun Sun, Xiangdong Ding and Masaki Azuma

Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU), Beihang University (BUAA) - School of Materials Science and Engineering, Tokyo Institute of Technology, Japan Synchrotron Radiation Research Institute, QST hospital (former NIRS Hospital) - Quantum Beam Science Research Directorate, National Institutes for Quantum and Radiological Science and Technology, University of the Basque Country, Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials and Tokyo Institute of Technology - Laboratory for Materials and Structures

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Abstract:

2.

Low thermal expansion and high thermal conductivity in epoxy molding compounds achieved via a dual-strategy of negative thermal expansion Cu2V2O7 and conductive fillers

Number of pages: 39 Posted: 21 Nov 2025

Yiping Lv, Feiyu Qin, Jijuan Wu, Jin Xin, Xiaoya Bai, Jun Sun, Xiangdong Ding and Lei Hu

affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Dalian University of Technology, affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials and Xi'an Jiaotong University (XJTU)

Downloads 53 (1,031,043)

Abstract:

3.

Incorporating Negative Thermal Expansion Cu2v2o7 into Epoxy to Achieve Low Thermal Expansion and High Thermal Conductivity

Number of pages: 25 Posted: 19 Nov 2024

Junqi Li, Feiyu Qin, Yiping Lv, Xin Yang, Tianhang Wu, Xiaoling Wang, Wenhui Xu, Nianjie Liu, Lei Hu, Jun Sun and Xiangdong Ding

affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials and Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials

Downloads 34 (1,263,436)

Abstract:

4.

Reply to Comments on “Integrating Abnormal Thermal Expansion and Ultralow Thermal Conductivity Into (Cd,ni)2Re2O7 via Synergy of Local Structure Distortion and Soft Acoustic Phonons”

Number of pages: 7 Posted: 27 Mar 2026

Feiyu Qin, Xiaoya Bai, Yuewen Fang and Lei Hu

Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU), University of the Basque Country and Xi'an Jiaotong University (XJTU)

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Lei Hu

Xi'an Jiaotong University (XJTU)

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Scholarly Papers (4)

Integrating Abnormal Thermal Expansion and Ultralow Thermal Conductivity into (Cd,Ni)2re2o7 Via Synergy of Local Structure Distortion and Soft Acoustic Phonons

Abstract:

Low thermal expansion and high thermal conductivity in epoxy molding compounds achieved via a dual-strategy of negative thermal expansion Cu2V2O7 and conductive fillers

Abstract:

Incorporating Negative Thermal Expansion Cu2v2o7 into Epoxy to Achieve Low Thermal Expansion and High Thermal Conductivity

Abstract:

Reply to Comments on “Integrating Abnormal Thermal Expansion and Ultralow Thermal Conductivity Into (Cd,ni)2Re2O7 via Synergy of Local Structure Distortion and Soft Acoustic Phonons”

Abstract: