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Jin Xin

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Low thermal expansion and high thermal conductivity in epoxy molding compounds achieved via a dual-strategy of negative thermal expansion Cu2V2O7 and conductive fillers

Number of pages: 39 Posted: 21 Nov 2025
Yiping Lv, Feiyu Qin, Jijuan Wu, Jin Xin, Xiaoya Bai, Jun Sun, Xiangdong Ding and Lei Hu
affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Dalian University of Technology, affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials and Xi'an Jiaotong University (XJTU)
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Abstract:

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Electronic packing materials ； Epoxy molding compound (EMC)；Negative thermal expansion (NTE) ； Epoxy/NTE composite