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Yiping Lv

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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91

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Scholarly Papers (2)

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1.

Low thermal expansion and high thermal conductivity in epoxy molding compounds achieved via a dual-strategy of negative thermal expansion Cu2V2O7 and conductive fillers

Number of pages: 39 Posted: 21 Nov 2025
Yiping Lv, Feiyu Qin, Jijuan Wu, Jin Xin, Xiaoya Bai, Jun Sun, Xiangdong Ding and Lei Hu
affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Dalian University of Technology, affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials and Xi'an Jiaotong University (XJTU)
Downloads 55 (1,031,043)

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Electronic packing materials ； Epoxy molding compound (EMC)；Negative thermal expansion (NTE) ； Epoxy/NTE composite

2.

Incorporating Negative Thermal Expansion Cu2v2o7 into Epoxy to Achieve Low Thermal Expansion and High Thermal Conductivity

Number of pages: 25 Posted: 19 Nov 2024
Junqi Li, Feiyu Qin, Yiping Lv, Xin Yang, Tianhang Wu, Xiaoling Wang, Wenhui Xu, Nianjie Liu, Lei Hu, Jun Sun and Xiangdong Ding
affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Xi'an Jiaotong University (XJTU), Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials and Xi'an Jiaotong University (XJTU) - State Key Laboratory for Mechanical Behavior of Materials
Downloads 36 (1,263,436)

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Electronic packing materials, Epoxy molding compound (EMC), Negative thermal expansion (NTE), Epoxy/NTE composite